Full size Solderless Bread board. Model: GL-12

• Dimensions : 172mm x 65mm x 10mm
• Tie points : 840
• 5 interconnect clip : 128
• 25 interconnect clip : 8
• IC capacity 14 pin : 9
• Weight : 130 grams
• Temperature range: -20 ~ +80?.
• Contact resistance: 100 mO max.
• Insulation resistance: 1000MO min.
• Dielectric withstanding voltage: 500V AC per 1 minute.
• Group of 5 connected terminals
• Bus of 25 connected terminals

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Description

• Dimensions : 172mm x 65mm x 10mm
• Tie points : 840
• 5 interconnect clip : 128
• 25 interconnect clip : 8
• IC capacity 14 pin : 9
• Weight : 130 grams
• Temperature range: -20 ~ +80?.
• Contact resistance: 100 mO max.
• Insulation resistance: 1000MO min.
• Dielectric withstanding voltage: 500V AC per 1 minute.
• Group of 5 connected terminals
• Bus of 25 connected terminals